KONNEKTTM technology uses an innovative TLPS (Transient Liquid Phase Sintering) material in which a low melting point metal or alloy reacts at low temperature with a high melting point metal or alloy to form a reactive metal matrix. The result is a highly conductive interconnect material that can be used to join multiple MLCCs. The result is stacked "multi-chip" devices without lead frames that can be aligned horizontally and vertically. This makes it easy to reduce the space required on the PCB.
Benefits at a glance:
- Space saving on the PCB
- Low ESR and ESL
- High ripple current
- Commercial and automotive quality
- C0G(NP0), U2J(N750) and X7R dielectrics
- Wide temperature range from -55 °C up to +150 °C
Other applications:
- Wide bandgap (WBG), silicon carbide (SiC), and gallium nitride (GaN) based systems
- Data centres
- EV/HEV (drive systems, charging)
- LLC resonant converters
- Switched tank converters
- Wireless charging systems
- Photovoltaic
- Power converters
- Inverter
- DC link
- Snubber
For more information about the KONNEKTTM MLCC portfolio by KEMET and a direct ordering option, please visit our e-commerce platform at www.rutronik24.com.
Contact Rutronik:
Jürgen Geier | Technical Expert Ceramic Capacitors | +49 7231 801 1410 | juergen.geier@rutronik.com
