About Apacer
“Becoming Better Partners” - The Most Reliable SSD and DRAM Solutions for Industries
Apacer Technology provides a wide range of industrial SSDs, digital consumer products, and memory modules. With its strong R&D, design, manufacturing, and marketing, the company has become a leading global manufacturer in the industry.
In alignment with global technology, Apacer is equipped with a fully automated and intelligent production plant. Apacer possesses advanced equipment and high-quality monitoring devices and boasts extensive experience in customized production, along with excellent R&D capabilities.
Our product lines are diversified, covering solutions for memory modules, industrial SSDs, consumer digital storage products and Internet of Things integrated applications.
We continually create innovative, diversified storage solutions and hardware/software integration services for various industries across defense, factory automation, gaming, healthcare, Internet of Things, Server and Networking, and Transportation applications.
Apacer Technology was founded in 1997 and has offices in Taiwan (Headquarter), USA, Netherlands, China, India, and Japan.
Featured Products
PV19E-25M
Form Factor: U.3 15mm
Interface: PCIe Gen4 x4
Capacities: 1920GB~30720GB
PV19E-25W
Form Factor: U.3 15mm
Interface: PCIe Gen4 x4
Capacities: 1600GB~25600GB
SV24E-25
Form Factor: 2.5”
Interface: SATA 3.2 (6Gb/s)
Capacities: 240GB~1920GB
PV16E-M280
Form Factor: M.2 2280
Interface: PCIe Gen4 x4
Capacities: 480GB~1920GB
PV25E-M280
Form Factor: M.2 2280
Interface: PCIe Gen4 x4
Capacities: 240GB~1920GB
SV24E-M280
Form Factor: M.2 2280
Interface: SATA 3.2 (6Gb/s)
Capacities: 240GB~1920GB
PV16E-M2110
Form Factor: CFast
Interface: SATA 3.2
Capacities: 10~160GB
EM120-eMMC
Form Factor: 153 Ball FBGA
Interface: eMMC5.1 HS400
Capacities: 8GB
ET130-eMMC
Form Factor: 153 Ball FBGA
Interface: eMMC5.1 HS400
Capacities: 16GB~32GB
EM110-eMMC
Form Factor: 153 Ball FBGA
Interface: eMMC5.1 HS400
Capacities: 8GB~16GB
ET150-eMMC
Form Factor: 153 Ball FBGA
Interface: eMMC5.1 HS400
Capacities: 64GB~128GB
DDR5 UDIMM
Frequency: 4800/5600
Density: 8G/16G/32G
Temperature: 0℃ to 85℃
DDR5 SODIMM
Frequency: 4800/5600
Density: 8G/16G/32G
Temperature: 0℃ to 85℃
DDR5 RDIMM
Frequency: 4800/5600
Density: 16GB/32GB/64GB/128GB
Temperature: 0℃ to 85℃
DDR5 ECC UDIMM
Frequency: 4800/5600
Density: 16G/32G
Temperature: 0℃ to 85℃
DDR5 ECC SODIMM
Frequency: 4800/5600
Density: 16G/32G
Temperature: 0℃ to 85℃
AH322-M WORM
Form Factor: USB flash drive
Interface: USB 2.0
Capacities: 8GB~32GB
SD-WORM
Form Factor: SD
Interface: SD 6.1
Capacities: 8GB~128GB
MSD-WORM
Form Factor: SD
Interface: SD 6.1
Capacities: 8GB~128GB
Product Guide Download
Industrial SSD & DRAM 2024
Enterprise SSDs 2024
WORM 2024
Featured Technologies
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Leave Us a Message
Address
Rutronik Europe
Rutronik Europe
Rutronik Elektronische Bauelemente GmbH
Industriestrasse 2
D-75228 Ispringen
Phone
+49 (7231) 801-0
Rutronik America
Rutronik America
Rutronik Inc.
2745 North Dallas Parkway Suite 660
Plano, TX 75093
Phone
+1 469-782-0900