Rutronik connects: Bluetooth Technologies Webinars

Bluetooth is a wireless technology standard implemented for exchanging data over usually short distances from fixed and mobile devices, building Personal Area Networks (PANs). Bluetooth LE supports multiple communication topologies, expanding from point-to-point to broadcast and, most recently, mesh, enabling Bluetooth technology to support the creation of reliable, large-scale device networks. The Bluetooth SIG member community continues to expand the capabilities of Bluetooth® technology - powering innovation, creating new markets, and redefining what is possible in wireless communication. Main target markets: audio streaming, data transfer, location services and device networks. 

Due to the ongoing strong growth of connected consumer electronics devices, combined with the growing adoption of LE Audio, peripherals will continue to drive the growth of single-mode Bluetooth LE device shipments.

Within our Bluetooth week we will discuss about the next generation of BLE devices and their advantages. You will learn how applications are benefiting from adding Bluetooth® LE connectivity. Leading manufactures such as Nordic Semiconductor, Infineon as well as Panasonic, Insight SiP and MinewSemi will promote the new technology trends.   

Be part of the webinar series and get exclusive information from our experts!

6 Webinars in 5 Days

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Next generation Bluetooth 6: PAN B511-1 Module based on nRF54L15 

Monday, November 4
10:00 - 11:00 a.m. (CET)

Tomislav Tipura - Product Manager IoT Panasonic
Kerstin Naser - Corporate Product Manager Rutronik

Join us for an exclusive streaming webinar as we unveil the latest advancements in Bluetooth technology.
Discover the groundbreaking Bluetooth 6 PAN B511-1C Module. The PAN B511-1C, built on Nordic’s newest chipset nRF54L15, features a unique hybrid design with Castellated holes and LGA footprint, offering a cost-effective solution for high-performance Bluetooth Low Energy and Matter applications.
Additionally, learn about Panasonic’s new PAN MaX Service, designed to simplify the production of Matter devices by providing smart-home device vendors with all the necessary security infrastructure for Matter deployments under one roof, enabling hassle-free production.


Introduction of the nRF54 Series BLE Modules

Tuesday, November 5
10:00 - 11:00 a.m. (CET)

Eddie Wang - Sales Manager MinewSemi
Heike Kubisch - Corporate Product Manager Rutronik

Introduction of our Bluetooth low energy module solutions based on Nordic Semiconductor nRF54L15, nRF54H20 and nRF54L15+nRF21540 FEM.


Ultra-low power solutions with modern Bluetooth Low Energy SoCs and software

Wednesday, November 6
10:00 - 11:00 a.m. (CET)

Pawel Kanafek - Senior Product Marketing Engineer Nordic Semiconductor
Julian Clauß - Corporate Product Manager Rutronik 

Explore how to use recent features of Bluetooth Low Energy applications with new features such as Channel Sounding and PAwR (Periodic Advertising with Responses). Learn practical strategies for optimizing power consumption through an in-depth PAwR sensor network demo.


Bluetooth Antennas and Indoor Positioning with BLE

Wednesday, November 6
11:15 am - 12.15 p.m. (CET)

Jens Kattenbusch - Regional Technical Sales Manager KAVX
Tobias Lusch- Corporate Product Manager Rutronik

KYOCERA AVX introduces their BLE antenna portfolio and the considerations for high accuracy in indoor location. 
Their multiple global antenna design centers are available for support, testing and optimization services.


Upgrading your BLE capability – state of the art BLE modules in the same family footprint

Thursday, November 7
02:00 - 03:00 p.m. (CET)

Nick Wood - Sales and Marketing Director Insight SiP
Heike Kubisch - Corporate Product Manager Rutronik

The next generation of BLE devices is with us, based on Nordic’s nRF54 platform. 
These offer improved performance and capabilities across a wide range of features, whilst retaining a diverse range of products from highly sophisticated to “entry level”. 
This webinar discusses Insight SIP’s module offer and the simplified upgrade path from previous nRF52/3 generation products.


BLE Chipset & Module Products & Solutions Overview

Friday, November 8
10:00 - 11:00 a.m. (CET)

Marc Biehn - Head FAE C3 EMEA BRE Segment Infineon
Torsten Killinger - Corporate Product Manager Rutronik

In this webinar Infineon will introduce us to their newest BT and BLE product solutions, as well as their new generation of BLE and Thread Chipsets. 
Additionally they will talk about Matter, the new license-free standard for smart home. 


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